Hyuck Mo Lee : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (256)
Les plus populaires
Liste
- Liste
- Tableau

1

A combinatorial approach for the synthesis and analysis of AlxCryMozNbTiZr high-entropy alloys: Oxidation behavior

Waseem, Owais Ahmed, Auyeskhan, Ulanbek, Lee, Hyuck Mo, Ryu, Ho Jin

Journal:

Journal of Materials Research

Année:

2018

Langue:

english

Fichier:

PDF, 885 KB

english, 2018

2

Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

Sun-Kyoung Seo, Sung K. Kang, Moon Gi Cho, Hyuck Mo Lee

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2010

Fichier:

PDF, 14.34 MB

2010

3

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Sun-Kyoung Seo, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee

Journal:

Microelectronics Reliability

Année:

2009

Langue:

english

Fichier:

PDF, 3.96 MB

english, 2009

4

M2C precipitates in isothermal tempering of high Co-Ni secondary hardening steel

Choong Hwa Yoo, Hyuck Mo Lee, Jin W. Chan, John W. Morris

Journal:

Metallurgical and Materials Transactions A

Année:

1996

Langue:

english

Fichier:

PDF, 841 KB

english, 1996

5

Coarsening resistance of M2C carbides in secondary hardening steels: Part III. Comparison of theory and experiment

Hyuck Mo Lee, Samuel M. Allen

Journal:

Metallurgical and Materials Transactions A

Année:

1991

Langue:

english

Fichier:

PDF, 2.06 MB

english, 1991

6

Coarsening resistance of M2C carbides in secondary hardening steels: Part II. Alloy design aided by a thermochemical database

Hyuck Mo Lee, Samuel M. Allen, Mica Grujicic

Journal:

Metallurgical and Materials Transactions A

Année:

1991

Langue:

english

Fichier:

PDF, 761 KB

english, 1991

7

ISOTHERMAL M2C CARBIDE GROWTH IN ULTRAHIGH STRENGTH HIGH Co-Ni STEELS

Hyuck Mo Lee, Hyunchul Sohn, Choong Hwa Yoo

Journal:

Scripta Materialia

Année:

1997

Langue:

english

Fichier:

PDF, 1.10 MB

english, 1997

8

Effect of Ag Addition on the Ripening Growth of Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Moon Gi Cho, Yong Sung Park, Sun-Kyoung Seo, Kyung-Wook Paik, Hyuck Mo Lee

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2011

9

Gradient generation by an osmotic pump and the behavior of human mesenchymal stem cells under the fetal bovine serum concentration gradient

Park, Joong Yull, Hwang, Chang Mo, Lee, Soon Hyuck, Lee, Sang-Hoon

Journal:

Année:

2007

Langue:

english

Fichier:

PDF, 790 KB

english, 2007

10

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions

Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, Lee, Hyuck Mo

Journal:

Journal of Electronic Materials

Année:

2014

Langue:

english

Fichier:

PDF, 3.54 MB

english, 2014

11

Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors

Choi, Chung Seok, Yeo, Sang Chul, Kim, Dohwan, Kim, Jongchae, Yoo, Kyung Dong, Lee, Hyuck Mo

Journal:

Journal of Electronic Materials

Année:

2014

Langue:

english

Fichier:

PDF, 3.68 MB

english, 2014

12

Delayed surgical treatment for tibial avulsion fracture of the posterior cruciate ligament in children

Jang, Ki-Mo, Lee, Soon-Hyuck

Journal:

Knee Surgery, Sports Traumatology, Arthroscopy

Année:

2016

Langue:

english

Fichier:

PDF, 674 KB

english, 2016

13

[O56] Fabrication of Ag-Cu Nanoparticles Based on the Nano-Phase Diagram and Anti-Oxidation Effects

Kim, Na Rae, Shin, Kihyun, Lee, Hyuck Mo

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 223 KB

english, 2015

14

Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films

Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, Lee, Hyuck Mo

Journal:

Journal of Electronic Materials

Année:

2015

Langue:

english

Fichier:

PDF, 3.40 MB

english, 2015

15

A Study on the Growth Behavior and Stability of Molecular Layer Deposited Alucone Films Using Diethylene Glycol and Trimethyl Aluminum Precursors, and the Enhancement of Diffusion Barrier Properties by Atomic Layer Deposited Al 2 O 3 Capping

Choi, Dong-won, Yoo, Mi, Lee, Hyuck Mo, Park, Jozeph, Kim, Hyun You, Park, Jin-Seong

Journal:

ACS Applied Materials & Interfaces

Année:

2016

Langue:

english

Fichier:

PDF, 5.24 MB

english, 2016

16

Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications

Kim, Jong&nbsp, Hoon, Jeong, Sang&nbsp, Won, Lee, Hyuck&nbsp, Mo

Journal:

MATERIALS TRANSACTIONS

Année:

2002

Langue:

english

Fichier:

PDF, 347 KB

english, 2002

17

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Hermetic Packaging of Micro Scanner for Laser Display Applications

Choi, Won Kyoung, Cho, Moon Gi, Seo, Sun Kyoung, Lee, Hyuck Mo, Jeong, Byung Gil, Lee, Hwa-Sun, Ko, Young-Chul, Lee, Jin-Ho, Moon, Chang Youl

Année:

2005

Langue:

english

Fichier:

PDF, 838 KB

english, 2005

18

Effects of phase composition and elemental partitioning on soft magnetic properties of AlFeCoCrMn high entropy alloys

Jung, Chanwon, Kang, Ku, Marshal, Amalraj, Pradeep, Konda Gokuldoss, Seol, Jae-Bok, Lee, Hyuck Mo, Choi, Pyuck-Pa

Journal:

Acta Materialia

Année:

2019

Langue:

english

Fichier:

PDF, 2.56 MB

english, 2019

19

A feasible strategy to prepare quantum dot-incorporated carbon nanofibers as free-standing platforms

Song, Taeyoung, Cheong, Jun Young, Choi, Ji Yong, Park, Cheolmin, Lee, Chulhee, Lee, Changsoo, Lee, Hyuck Mo, Choi, Sung-Yool, Song, Hyunjoon, Kim, Il-Doo, Jeon, Duk Young

Journal:

Nanoscale Advances

Année:

2019

Langue:

english

Fichier:

PDF, 1.49 MB

english, 2019

20

Transparent Electronics: Integration of Ultrathin Silicon and Metal Nanowires for HighâPerformance Transparent Electronics (Adv. Mater. Technol. 4/2020)

Koo, Jahyun, Lee, Changsoo, Chu, Cho Rong, Kang, SeungâKyun, Lee, Hyuck Mo

Journal:

Advanced Materials Technologies

Année:

2020

Fichier:

PDF, 31.86 MB

2020

21

Highly active and stable stepped Cu surface for enhanced electrochemical CO2 reduction to C2H4

Choi, Chungseok, Kwon, Soonho, Cheng, Tao, Xu, Mingjie, Tieu, Peter, Lee, Changsoo, Cai, Jin, Lee, Hyuck Mo, Pan, Xiaoqing, Duan, Xiangfeng, Goddard, William A., Huang, Yu

Journal:

Nature Catalysis

Année:

2020

Fichier:

PDF, 5.44 MB

2020

22

Characteristics of metastasis in the breast from extramammary malignancies

Se Kyung Lee, Wan Wook Kim, Sung Hoon Kim, Sung Mo Hur, Sangmin Kim, Jae Hyuck Choi, Eun Yoon Cho, Soo Yeon Han, Boo-Kyung Hahn, Jun-Ho Choe, Jung-Han Kim, Jee Soo Kim, Jeong Eon Lee, Seok Jin Nam, Ju

Journal:

Journal of Surgical Oncology

Année:

2010

Langue:

english

Fichier:

PDF, 113 KB

english, 2010

23

Coarsening behavior of L12 precipitates in melt-spun AlTiVZr alloys

Hoseok Lee, Seung Zeon Han, Hyuck Mo Lee, Zin-Hyoung Lee

Journal:

Materials Science and Engineering: A

Année:

1993

Langue:

english

Fichier:

PDF, 1.03 MB

english, 1993

24

Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

Jae-Woong Nah, Jong Hoon Kim, Hyuck Mo Lee, Kyung-Wook Paik

Journal:

Acta Materialia

Année:

2004

Langue:

english

Fichier:

PDF, 711 KB

english, 2004

25

Adsorption properties of hydrogen on (10,0) single-walled carbon nanotube through density functional theory

Sang Soo Han, Hyuck Mo Lee

Journal:

Année:

2004

Langue:

english

Fichier:

PDF, 570 KB

english, 2004

26

Nucleation mechanism of carbon nanotube

Sang Soo Han, Kyung Sub Lee, Hyuck Mo Lee

Journal:

Chemical Physics Letters

Année:

2004

Langue:

english

Fichier:

PDF, 380 KB

english, 2004

27

Effects of Mn on the crystal structure of α-Al(Mn,Fe)Si particles in A356 alloys

Hyun You Kim, Tea Young Park, Sang Won Han, Hyuck Mo Lee

Journal:

Journal of Crystal Growth

Année:

2006

Langue:

english

Fichier:

PDF, 260 KB

english, 2006

28

Finite-element method study for the spin-polarized transport in a hybrid spin valve

Eun Sun Noh, Sergio E. Ulloa, Hyuck Mo Lee

Journal:

Journal of Magnetism and Magnetic Materials

Année:

2007

Langue:

english

Fichier:

PDF, 123 KB

english, 2007

29

Phase stability of Pt nanoclusters and the effect of a (0 0 0 1) graphite surface through molecular dynamics simulation

Sung Hoon Lee, Sang Soo Han, Jeung Ku Kang, Ji Hoon Ryu, Hyuck Mo Lee

Journal:

Surface Science

Année:

2008

Langue:

english

Fichier:

PDF, 815 KB

english, 2008

30

Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

Byeong-Joo Lee, Nong Moon Hwang, Hyuck Mo Lee

Journal:

Acta Materialia

Année:

1997

Langue:

english

Fichier:

PDF, 851 KB

english, 1997

31

Alloy design of intermetallic dispersion strengthened aluminum systems by mechanical alloying for high temperature applications

Sung II Park, Hyuck Mo Lee

Journal:

Metals and Materials International

Année:

2000

Langue:

english

Fichier:

PDF, 1.75 MB

english, 2000

32

Molecular dynamics simulation of zigzag single-walled carbon nanotube closing mechanisms

Sang Soo Han, Hyuck Mo Lee

Journal:

Metals and Materials International

Année:

2003

Langue:

english

Fichier:

PDF, 1.01 MB

english, 2003

33

Is Robotic Surgery Superior to Endoscopic and Open Surgeries in Thyroid Cancer?

Wan Wook Kim, Jee Soo Kim, Sung Mo Hur, Sung Hoon Kim, Se-Kyung Lee, Jae Hyuck Choi, Sangmin Kim, Jeong Eon Lee, Jung-Han Kim, Seok Jin Nam, Jung-Hyun Yang, Jun-Ho Choe

Journal:

World Journal of Surgery

Année:

2011

Langue:

english

Fichier:

PDF, 232 KB

english, 2011

34

Investigation of the phase equilibria in the Sn-Bi-In alloy system

Seung Wook Yoon, Byung-Sup Rho, Hyuck Mo Lee, Choong-Un Kim, Byeong-Joo Lee

Journal:

Metallurgical and Materials Transactions A

Année:

1999

Langue:

english

Fichier:

PDF, 1.12 MB

english, 1999

35

Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate

Won Kyoung Choi, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2000

Langue:

english

Fichier:

PDF, 474 KB

english, 2000

36

Three-dimensional monte-carlo simulation of grain growth in Pt-Co thin film

Sung Il Park, Sang Soo Han, Hyoung Gyu Kim, Joong Keun Park, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2002

Langue:

english

Fichier:

PDF, 1.14 MB

english, 2002

37

A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system

Jong Hoon Kim, Sang Won Jeong, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2002

Langue:

english

Fichier:

PDF, 262 KB

english, 2002

38

Morphological transition of interfacial Ni3Sn4grains at the Sn-3.5Ag/Ni joint

Jong Hoon Kim, Sang Won Jeong, Hyun Deuk Kim, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2003

Langue:

english

Fichier:

PDF, 529 KB

english, 2003

39

Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging

Sang Won Jeong, Jong Hoon Kim, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2004

Langue:

english

Fichier:

PDF, 3.54 MB

english, 2004

40

Foreword

Sinn-Wen Chen, C. Robert Kao, Hyuck Mo Lee, Suzanne Mohney, Katsuaki Suganuma, Douglas J. Swenson, Srinivas Chada

Journal:

Journal of Electronic Materials

Année:

2006

Langue:

english

Fichier:

PDF, 32 KB

english, 2006

41

Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging

Moon Gi Cho, Kyung Wook Paik, Hyuck Mo Lee, Seong Woon Booh, Tae-Gyu Kim

Journal:

Journal of Electronic Materials

Année:

2006

Langue:

english

Fichier:

PDF, 517 KB

english, 2006

42

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Sun-Kyoung Seo, Moon Gi Cho, Hyuck Mo Lee, Won Kyoung Choi

Journal:

Journal of Electronic Materials

Année:

2006

Langue:

english

Fichier:

PDF, 481 KB

english, 2006

43

Foreword

Katsuaki Suganuma, Sinn-wen Chen, C. Robert Kao, Hyuck Mo Lee, Douglas J. Swenson, Srinivas Chada

Journal:

Journal of Electronic Materials

Année:

2006

Langue:

english

Fichier:

PDF, 29 KB

english, 2006

44

Foreword

Sinn-wen Chen, Srinivas Chada, Chih-ming Chen, A. Lindsay Greer, Young-chang Joo, Hyuck Mo Lee, Daniel J. Lewis, Katsuaki Suganuma

Journal:

Journal of Electronic Materials

Année:

2007

Langue:

english

Fichier:

PDF, 69 KB

english, 2007

45

Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System

Sun-Kyoung Seo, Moon Gi Cho, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2007

Langue:

english

Fichier:

PDF, 554 KB

english, 2007

46

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Moon Gi Cho, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2007

Langue:

english

Fichier:

PDF, 706 KB

english, 2007

47

Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging

Yun-Hwan Jo, Joo Won Lee, Sun-Kyoung Seo, Hyuck Mo Lee, Hun Han, Dong Chun Lee

Journal:

Journal of Electronic Materials

Année:

2008

Langue:

english

Fichier:

PDF, 736 KB

english, 2008

48

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM

Dong Hoon Kim, Moon Gi Cho, Sun-Kyoung Seo, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 505 KB

english, 2009

49

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

Sun-Kyoung Seo, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 649 KB

english, 2009

50

Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

Moon Gi Cho, Sung K. Kang, Sun-Kyoung Seo, Da-Yuan Shih, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 609 KB

english, 2009